Integrated circuits with lateral bipolar transistors and methods for fabricating the same
US9761664B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 20, 2016 |
| Grant date | Sep 12, 2017 |
| Priority date | — |
| Expiry date | Apr 20, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D84/645
Abstract
Integrated circuits with lateral bipolar transistors and methods for fabricating the same are provided. An exemplary integrated circuit includes a semiconductor layer overlying an insulator layer. The semiconductor layer includes a first region having a first thickness and a trench region having a second thickness less than the first thickness. The integrated circuit further includes an isolation region formed over the trench region of the semiconductor layer. Also, the integrated circuit includes a lateral bipolar transistor including a base formed in the trench region of the semiconductor layer, an emitter, and a collector.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.