Patent · US Active

Method of manufacturing a mechanical resonating structure

US9762202B2 · kind B2 · utility

151Cited by

87References

13Claims

0Family size

Assignee

Analog Devices, Inc. · US

Inventors

Florian Thalmayr · Unterhaching, DE
Jan H. Kuypers · Cambridge, US
Klaus Juergen Schoepf · Chandler, US

Key dates

Filing date	Feb 11, 2014
Grant date	Sep 12, 2017
Priority date	—
Expiry date	Jun 27, 2035

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/4908
WIPO fieldBasic communication processes
WIPO sectorElectrical engineering

Abstract

Methods are described for constructing a mechanical resonating structure by applying an active layer on a surface of a compensating structure. The compensating structure comprises one or more materials having an adaptive resistance to deform that reduces a variance in a resonating frequency of the mechanical resonating structure, wherein at least the active layer and the compensating structure form a mechanical resonating structure having a plurality of layers of materials A thickness of each of the plurality of layers of materials results in a plurality of thickness ratios therebetween.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.