Systems and methods for supplying reference voltage to multiple die of different technologies in a package
US9762238B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 3, 2017 |
| Grant date | Sep 12, 2017 |
| Priority date | — |
| Expiry date | Apr 3, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L25/065
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A system in a package (SIP) has a first die with a first internal voltage level, first die-to-die output circuitry, first die-to-die input circuitry, and first internal logic and a second die with a second internal voltage level, second die-to-die output circuitry, second die-to-die input circuitry, and second internal logic. A first signal is provided to the second internal logic via the first die-to-die output circuitry and the second die-to-die input circuitry, wherein each of the first die-to-die output circuitry and second die-to-die input circuitry selectively level shift the first signal based on the first and second internal voltage levels. A second signal is provided to the first internal logic via the second die-to-die output circuitry and the first die-to-die input circuitry, wherein each of the second die-to-die output circuitry and first die-to-die input circuitry selectively level shift the second signal based on the first and second internal voltage levels.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.