Multi-layered electronic system
US9763321B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 10, 2015 |
| Grant date | Sep 12, 2017 |
| Priority date | — |
| Expiry date | Mar 23, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09263
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multi-layered electronic system has a support substrate including at least a primary conductive track; a security layer including at least a conductive security track; an electrically-conductive engagement element in electrical communication with the primary conductive tack, and to which the security layer is mounted so that the conductive security track is in permanent electrical communication with the primary conductive track; and a flexible cover layer which overlies the security layer and which is directly or indirectly secured to the support substrate. The electrical connection between the security layer, conductive engagement element and primary conductive track is interrupted when the conductive security track is broken.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.