MEMS cap with multi pressure
US9764948B2 · kind B2 · utility
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3References
20Claims
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Assignee
Inventors
Key dates
| Filing date | Jan 21, 2016 |
| Grant date | Sep 19, 2017 |
| Priority date | — |
| Expiry date | Jan 21, 2036 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2203/0118
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
Micro-electromechanical (MEMS) devices and methods of forming are provided. An outgas layer is deposited on a surface of a cap wafer. The cap wafer is bonded to a substrate in a manner that forms a first sealed cavity including a first movable element and a second sealed cavity including a second movable element. The out gas layer is annealed to release gas from the out gas layer into the second sealed cavity and increase a pressure of the second sealed cavity so that the second sealed cavity has a higher pressure than the first sealed cavity after the annealing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.