Patent · US Active

Method and device for separating a substrate

US9764978B2 · kind B2 · utility

2Cited by

3References

15Claims

0Family size

Assignee

LPKF LASER & ELECTRONICS AG · DE

Inventors

Robin Alexander Krueger · Hannover, DE
Norbert Ambrosius · Kevelaer, DE
Roman Ostholt · Langenhagen, DE

Key dates

Filing date	Apr 3, 2014
Grant date	Sep 19, 2017
Priority date	—
Expiry date	Apr 3, 2034

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC03C2218/32
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

A method and device for separating a substrate with a laser beam. The duration of the laser beam's effect is extremely short, so the substrate is only modified concentrically about the laser beam axis (Z) without it degrading the substrate material. While the laser beam acts upon the substrate, the substrate moves relative to a laser machining head, producing plural filament-type modifications along a separating surface to be incorporated. The laser beam is initially diverted by a transmission medium having a higher intensity dependent refractive index than air, then reaches the substrate. The non-constant pulsed laser intensity increases to a maximum over the temporal course of the single pulse, then reduces, and the refractive index changes. The laser beam focus point moves between the substrate's outer surfaces along the beam axis (Z), reaching the desired modification along the beam axis (Z) without correcting the laser machining head in the z-axis.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.