Compositions of resin-linear organosiloxane block copolymers
US9765192B2 · kind B2 · utility
2Cited by
1References
31Claims
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Key dates
| Filing date | Sep 18, 2014 |
| Grant date | Sep 19, 2017 |
| Priority date | — |
| Expiry date | Sep 18, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8511
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present disclosure provides hydrosilylation curable compositions comprising resin linear organosiloxane block copolymers comprising, among other things, from about 0.5 to about 5 mole % C1 to C30 hydrocarbyl group comprising at least one aliphatic unsaturated bond. Such hydrosilylation curable resin-linear organosiloxane block copolymers have significantly faster cure speed, relative to their condensation curable counterparts. A faster cure speed can be important for encapsulating electronic devices, such as light-emitting diode (LED) chip devices, particularly devices having tall structures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.