One-component, solvent-free organosiloxane composition for application to printed circuit boards by means of a cross-cut nozzle
US9765236B2 · kind B2 · utility
1Cited by
3References
23Claims
0Family size
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Key dates
| Filing date | Mar 13, 2014 |
| Grant date | Sep 19, 2017 |
| Priority date | — |
| Expiry date | Nov 15, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31663
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
One-component, solvent-free organosiloxane composition comprising
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.