Adhesive composition and structure comprising at least one layer of the said composition
US9765248B2 · kind B2 · utility
1Cited by
6References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 2, 2015 |
| Grant date | Sep 19, 2017 |
| Priority date | — |
| Expiry date | Nov 2, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31728
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The invention relates to an adhesive composition comprising the mass-weighted mean of the heats of fusion of these polyamides in the said composition being greater than 25 J/g (DSC),the mean number of carbon atoms per nitrogen atom of the polyamides A, B and C also satisfying the following strict inequality: CA<CB<CC,and also to multilayer structures using the said composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.