Apparatus for deposition and substrate alignment method in the same
US9765428B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 23, 2015 |
| Grant date | Sep 19, 2017 |
| Priority date | — |
| Expiry date | Dec 1, 2035 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C14/042
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A deposition apparatus includes a sheet, an edge portion of which is integrally combined with a sheet frame, an electrostatic chuck attached to a bottom surface of the sheet, the electrostatic chuck adhering a substrate by a force of static electricity, a metal mask located below the electrostatic chuck, an edge portion of the metal mask being combined with a mask frame, the metal mask having a predetermined patterned opening, and the substrate being mounted to the upper surface of the metal mask, a transfer member coupled to a side surface of the sheet frame, the transfer member flattening the sheet by pulling the sheet to side directions, and a magnetic plate located above the sheet, the magnetic plate closely attaching the substrate to the electrostatic chuck by pulling the metal mask using a magnetic force.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.