Thermally managed LED arrays assembled by printing
US9765934B2 · kind B2 · utility
149Cited by
227References
40Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | May 15, 2012 |
| Grant date | Sep 19, 2017 |
| Priority date | — |
| Expiry date | Feb 24, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8585
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Provided herein are electronic devices including arrays of printable light emitting diodes (LEDs) having device geometries and dimensions providing enhanced thermal management and control relative to conventional LED-based lighting systems. The systems and methods described provide large area, transparent, and/or flexible LED arrays useful for a range of applications in microelectronics, including display and lightning technology. Methods are also provided for assembling and using electronic devices including thermally managed arrays of printable light emitting diodes (LEDs).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.