Integrated circuit with sensor and method of manufacturing such an integrated circuit
US9766195B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 15, 2012 |
| Grant date | Sep 19, 2017 |
| Priority date | — |
| Expiry date | Aug 5, 2033 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2884
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Disclosed is an integrated circuit (IC) comprising a substrate (10) carrying a plurality of circuit elements; a metallization stack (12, 14, 16) interconnecting said circuit elements, said metallization stack comprising a patterned upper metallization layer comprising at least one sensor electrode portion (20) and a bond pad portion (22), at least the at least one sensor electrode portion of said patterned upper metallization layer being covered by a moisture barrier film (23); a passivation stack (24, 26, 28) covering the metallization stack, said passivation stack comprising a first trench (32) exposing the at least one sensor electrode portion and a second trench (34) exposing the bond pad portion; said first trench being filled with a sensor active material (36). A method of manufacturing such an IC is also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.