Parameterized installation packages
US9766869B2 · kind B2 · utility
1Cited by
29References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 16, 2009 |
| Grant date | Sep 19, 2017 |
| Priority date | — |
| Expiry date | Oct 12, 2031 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F8/61
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
An installation package may have metadata concerning optional parameters for a software package to be installed. The metadata may be read by an installation system, and a user interface presented to a user for input on the parameters values. The installation system may store the parameters for later replication of the installation. The installation system may perform the installation on a local device or a remote device, and may further be capable of presenting the user interface on another device. In some embodiments, the metadata may be available to the installation system without having to open the installation package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.