Wire bonding electrical lapping guides for tape head module
US9767833B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 15, 2016 |
| Grant date | Sep 19, 2017 |
| Priority date | — |
| Expiry date | Aug 15, 2036 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11B21/16
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A process for manufacturing a magnetic tape head module involves depositing over a wafer substrate electrical traces from respective electrical lapping guides (ELGs) to an area at an end of a tape head module also formed over the substrate, fabricating a closure adjacent to the tape head module where the closure terminates outside of the area at the end of the tape head module, and electrically connecting the electrical traces to an external circuit using a wire-bonding procedure, thereby electrically connecting each ELG to the external circuit. A plurality of electrical connection pads may be deposited at the area at the end of the tape head module, and each electrical trace electrically connected to one of the pads, where electrically connecting the traces to the external circuit includes wire-bonding the pads to the circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.