High-chi block copolymers for interconnect structures by directed self-assembly

US9768059B1 · kind B1 · utility

Assignee

• International Business Machines Corporation · US

Inventors

• Chi-Chun Liu · Altamont, US
• Teddie Peregrino Magbitang · San Jose, US
• Daniel P. Sanders · San Jose, US
• Kristin Schmidt · Mountain View, US
• Ankit Vora · San Jose, US

Key dates

• Filing date: Apr 7, 2016
• Grant date: Sep 19, 2017
• Expiry date: Apr 7, 2036

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/02112
• WIPO field: Optics
• WIPO sector: Instruments

Abstract

High-chi diblock copolymers are disclosed whose self-assembly properties are suitable for forming hole and bar openings for conductive interconnects in a multi-layered structure. The hole and bar openings have reduced critical dimension, improved uniformity, and improved placement error compared to the industry standard poly(styrene)-b-poly(methyl methacrylate) block copolymer (PS-b-PMMA). The BCPs comprise a poly(styrene) block, which can optionally include repeat units derived from trimethylsilyl styrene, and a second block that can be a polycarbonate block or a polyester block. Block copolymers comprising a fluorinated linking group L′ comprising 1-25 fluorines between the blocks can provide further improvement in uniformity of the openings.