Method of providing a flexible semiconductor device and flexible semiconductor device thereof
US9768107B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 22, 2016 |
| Grant date | Sep 19, 2017 |
| Priority date | — |
| Expiry date | Jul 22, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K77/111
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Some embodiments include a method. The method can include providing a carrier substrate, providing a release layer over the carrier substrate, and providing a device substrate over the carrier substrate and the release layer. Providing the device substrate can include bonding the device substrate to the carrier substrate, and bonding the device substrate to the release layer. Further, providing the release layer can include bonding the release layer to the carrier substrate. Meanwhile, the release layer can include polymethylmethacrylate, and the device substrate can be bonded to the carrier substrate with a first adhesion strength, the device substrate can be bonded to the release layer with a second adhesion strength less than the first adhesion strength, and the release layer can be bonded to the carrier substrate with a third adhesion strength greater than the second adhesion strength. Other embodiments of related methods and devices are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.