High flux diode packaging using passive microscale liquid-vapor phase change
US9768584B2 · kind B2 · utility
1Cited by
1References
10Claims
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Key dates
| Filing date | Mar 24, 2016 |
| Grant date | Sep 19, 2017 |
| Priority date | — |
| Expiry date | Mar 24, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/4025
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A laser diode package includes a heat pipe having a fluid chamber enclosed in part by a heat exchange wall for containing a fluid. Wicking channels in the fluid chamber is adapted to wick a liquid phase of the fluid from a condensing section of the heat pipe to an evaporating section of the heat exchanger, and a laser diode is connected to the heat exchange wall at the evaporating section of the heat exchanger so that heat produced by the laser diode is removed isothermally from the evaporating section to the condensing section by a liquid-to-vapor phase change of the fluid.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.