Land grid array interconnect formed with discrete pads
US9769924B2 · kind B2 · utility
0Cited by
12References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 3, 2014 |
| Grant date | Sep 19, 2017 |
| Priority date | — |
| Expiry date | Nov 3, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49208
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A land grid array (LGA) includes a grid array of metal pads plated directly onto a printed circuit board, and a discrete metal pad soldered to each of the plated metal pads in the grid array. Each discrete metal pad has an exposed contact surface after soldering, and a thickness of each discrete metal pad is selected as a function of location in the grid array so that the discrete pads provide a locus of exposed surfaces having greater flatness than the printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.