Interconnect structures for electronic devices with component arrays
US9769929B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | May 22, 2015 |
| Grant date | Sep 19, 2017 |
| Priority date | — |
| Expiry date | Aug 31, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10151
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An array of electrical components may be mounted in openings in an electronic device housing. The housing may have a cylindrical shape or other curved shape. A support structure such as a hollow cylindrical tube may be mounted within the interior of the housing. The electrical components may have terminals that mate with corresponding contacts on a flexible printed circuit. Interconnect paths on the flexible printed circuit may be used to route signals for the electrical components. The flexible printed circuit may be wrapped into the shape of a cylindrical tube and may be mounted on an interior surface of the cylindrical housing or on the exterior surface of the support structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.