Laser machining device and method for machining a workpiece by using a laser machining device
US9770784B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 2, 2015 |
| Grant date | Sep 26, 2017 |
| Priority date | — |
| Expiry date | Dec 22, 2035 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2101/20
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The invention relates to a method and a laser machining device 10 for machining a workpiece 13. The laser machining device 10 has a laser 11 for generating a laser beam 12, which is deflected by way of a deflecting device 15 in accordance with a pattern defined by a control unit 14 and is directed onto a workpiece surface 17 of a workpiece 13, which surface is to be machined. The point of impingement 18 of the deflected laser beam 12b on the workpiece surface 17 is guided along at least one spiral path within a circular hatched area 16. The spiral path 19 is characterized by spiral path parameters. One spiral path parameter is the line spacing a between neighboring points of intersection P of the spiral path 19 with an axis running through the center point M of the spiral path 19.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.