Slurry supply and/or chemical blend supply apparatuses, processes, methods of use and methods of manufacture
US9770804B2 · kind B2 · utility
8Cited by
113References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 18, 2014 |
| Grant date | Sep 26, 2017 |
| Priority date | — |
| Expiry date | Mar 18, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T137/87652
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A slurry and/or chemical blend supply apparatus suitable for providing slurry and/or chemical blend to chemical mechanical planarization (CMP) tools or other tools in a semiconductor fabrication facility, related processes, methods of use and methods of manufacture. The slurry and/or chemical blend supply apparatus includes one or more of the following: feed module, blend module, analytical module and distribution module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.