Multi-dimensional component build system and process
US9770866B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 14, 2014 |
| Grant date | Sep 26, 2017 |
| Priority date | — |
| Expiry date | Oct 2, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P10/25
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
An example multi-dimensional component building system includes a first chamber having at least one base disposed therein, a second chamber adjacent to and in fluid communication with the first chamber through a first door, and a third chamber adjacent to and in fluid communication with the second chamber through a second door. The second chamber is fluidly sealed from the first chamber if the first door is in a closed position. The second chamber is configured to receive the at least one base via a first transfer mechanism if the fluid parameters of the first chamber are approximately equal to the fluid parameters of the second chamber. The second chamber includes a directed heat source and a build-up material configured to form a component on the at least one base by melting or sintering. The third chamber is fluidly sealed from the second chamber if the first door is in a closed position. The third chamber is configured to receive the at least one base, having a formed component disposed thereon, via a second transfer mechanism if the second door is in an open position. The fluid parameters of the second chamber are not substantially affected by fluid communication with the firs…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.