Patent · US Active

Galvanized metal bonding adhesive formulation and process for the use thereof

US9771501B2 · kind B2 · utility

0Cited by
6References
21Claims
0Family size

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Key dates

Filing dateDec 11, 2013
Grant dateSep 26, 2017
Priority date
Expiry dateApr 20, 2035

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC09J147/00
  • WIPO fieldBasic materials chemistry
  • WIPO sectorChemistry

Abstract

A two-part adhesive formulation is provided that has an adhesive part A and an activator part B. The part A includes a monomer amount of a methacrylate ester monomer, a crosslinker amount of a polyfunctional monomer, an anti-oxidant, a free-radical polymerization inhibitor, and an adhesion promoter system to improve cured adhesive strength to a substrate, an impact modifier and a toughening agent and a free-radical polymerization initiator. The part B includes an impact modifier, butyl rubber, methacrylate ester monomer, and a free-radical polymerization accelerator yet varies in the weight ratio used relative to part A. Each of the part A and the part B have separate storage stability of at least 300 days at 23° C. A process of applying an adhesive to a substrate is provided that includes combining together parts A and B to form an adhesive mixture and applying the mixture to the substrate and allowed to cure.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.