System for forming floor underlayment
US9771727B2 · kind B2 · utility
1Cited by
7References
16Claims
0Family size
Inventors
Key dates
| Filing date | Feb 22, 2017 |
| Grant date | Sep 26, 2017 |
| Priority date | — |
| Expiry date | Feb 22, 2037 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T442/60
- WIPO fieldCivil engineering
- WIPO sectorOther fields
Abstract
A process for making a fibrous panel member and a flooring structure is disclosed. The flooring structure has a subfloor, a surface layer, and an insulative pad disposed between the subfloor and the surface layer. The insulative pad has an MDI binder and reinforcement fibers distributed uniformly and randomly within a first plane. The process includes mixing a porous fiber material with a MDI adhesive. The fiber batt is compressed between a pair of porous belts. Steam and heat are applied to the compressed batt to form a bound flexible batting material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.