Laser processing machines with barrier-free accesses

US9772067B2 · kind B2 · utility

Assignee

• TRUMPF Werkzeugmaschinen GmbH + Co. KG · DE

Inventors

• Andreas Bunz · Echterdingen, DE
• Detlef Breitling · Leonberg, DE

Key dates

• Filing date: Dec 17, 2014
• Grant date: Sep 26, 2017
• Expiry date: Dec 4, 2035

Classification

• Technology area (CPC F): Mechanical Engineering; Lighting; Heating
• CPC primary: F16P1/06
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

A laser processing machine arrangement includes a laser processing head for laser processing a workpiece, the workpiece comprising a processing zone from which laser radiation is emitted radially during operation of the laser processing head, a laser protection wall that surrounds the laser processing head and a danger region disposed around the laser processing head, the laser protection wall shielding the laser radiation that is emitted radially from the processing, and at least one opening in the laser protection wall, through which the danger region can be entered, wherein the laser protection wall and the at least one in the laser protection wall are arranged in such a manner that the at least one opening is completely shadowed by the laser protection wall or is completely shadowed with cooperation of the laser protection wall from the laser radiation during operation of the laser processing head.