Heat dissipation simulator
US9773084B2 · kind B2 · utility
0Cited by
3References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 25, 2014 |
| Grant date | Sep 26, 2017 |
| Priority date | — |
| Expiry date | Jun 25, 2036 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2119/08
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A heat dissipation simulator of a component on a printed circuit board (PCB) includes a simulation board and a simulated heat source. The simulation board includes an iron layer and a plastic layer. The simulated heat source includes a simulation chip, a thermal, and a heat sink. The simulation chip, the thermal piece, and the heat sink are mounted on the simulation board in that order. The heat dissipation simulator replaces a sample of the PCB with the component for simulating working states of the component on the PCB.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.