Electronic interface apparatus and method and system for manufacturing same
US9773201B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 23, 2015 |
| Grant date | Sep 26, 2017 |
| Priority date | — |
| Expiry date | Apr 23, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53178
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A method for manufacture of an electronic interface card including defining a pair of apertures in a substrate layer, associating an antenna with the substrate layer such that opposite ends of the antenna terminate at the apertures, placing a metal element in each of the apertures, connecting the ends of the antenna to the metal elements, laminating the substrate layer together with a top layer and a bottom layer, forming a recess in the top layer and the substrate layer, attaching ends of connection wires to the metal elements, attaching opposite ends of the connection wires to a chip module and sealing the chip module in the recess.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.