Electronic element and manufacturing method
US9773746B2 · kind B2 · utility
4Cited by
5References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 22, 2016 |
| Grant date | Sep 26, 2017 |
| Priority date | — |
| Expiry date | Jun 22, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/13019
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic element for an electronic apparatus includes a substrate; a bump, disposed on the substrate for electrically connecting the electronic apparatus; and at least one under bump metal layer, disposed between the bump and the substrate for the bump to be attached to the substrate; wherein the UBM layer forms a breach structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.