Method for reducing crosstalk in CMOS image sensor
US9773834B2 · kind B2 · utility
4Cited by
1References
13Claims
0Family size
Assignee
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Key dates
| Filing date | Oct 31, 2016 |
| Grant date | Sep 26, 2017 |
| Priority date | — |
| Expiry date | Oct 31, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/807
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing a CMOS image sensor includes providing a semiconductor substrate having a front side and a back side, forming at least two pixels in the front side, forming a shallow trench isolation in the front side between the at least two pixels, forming a deep trench in the back side at a location above the shallow trench isolation, and depositing a dielectric layer in the deep trench to form a crosstalk reduction element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.