Optical measurement of a component having structural features present at opposite sides
US9774828B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Feb 9, 2015 |
| Grant date | Sep 26, 2017 |
| Priority date | — |
| Expiry date | Feb 27, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K13/0812
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for mounting an electronic component (180) onto a component carrier (179) is described. The method comprises (a) optically capturing a first image from a first side of the component (180), at which first side a first structural feature (185) of the component (180) is discernible, by means of a first camera (120), (b) optically capturing a second image from a second side of the component (180), at which second side a second structural feature (186) of the component (180) is discernible, by means of a second camera (160), wherein the first side and the second side are situated opposite one another and wherein the second structural feature (186) is configured to be connected at a predetermined position on the component carrier (175), (c) orienting the electronic component (180) such that a center of the first structural feature (185) is aligned with a desired position relative to the component carrier (175), wherein the second structural feature (186) can be correspondingly offset from the predetermined position, and (d) mounting the electronic component (180) onto the component carrier (175), wherein the center of the first structural feature (185) is aligned relative to the…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.