Pad-array structure on substrate for mounting IC chip on substrate, and optical module having said pad-array structure
US9775245B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 18, 2015 |
| Grant date | Sep 26, 2017 |
| Priority date | — |
| Expiry date | Mar 18, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A pad-array arrangement structure on a substrate for mounting an IC chip on the substrate, wherein a structure with which it is possible to maximally avoid an increase in the number of wiring layers on the substrate is obtained by devising the pad arrangement in an IC pad-array region.A embodiment of the present invention provides a pad-array structure on a substrate for mounting an IC chip on the substrate. The present invention is characterized in that: a plurality of ground pads arrayed equidistantly in a first row, and a plurality of signal pads arrayed equidistantly in a second row on the inside of and parallel to the first row, are provided on a first circumferential edge in the pad-array region; each of the signal pads passes between two adjacent ground pads in the first row and is connected to an external circuit on the substrate; and electrical signals are input to and output from the external circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.