Patent · US Active

Thickness calibration of an embossing die

US9776372B2 · kind B2 · utility

0Cited by

3References

20Claims

0Family size

Assignee

HP INDIGO B.V. · NL

Inventors

Shahar Stein · Nes Ziona, IL
Eyal Peleg · Yafia, IL
George Trendafilov · Ashdod, IL
Itzik Shaul · Nes Ziona, IL

Key dates

Filing date	Mar 10, 2017
Grant date	Oct 3, 2017
Priority date	—
Expiry date	Mar 10, 2037

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB31F2201/0717
WIPO fieldTextile and paper machines
WIPO sectorMechanical engineering

Abstract

There is disclosed a computer program product for carrying out a method of calibrating a thickness of an embossing die, the embossing die being formed from a plurality of ink layers printed by an apparatus. According to the method, an average thickness of an ink layer printed by the apparatus may be calculated, and a target die thickness may be calculated as a function of the average ink layer thickness. A system for implementing a method of calibrating a thickness of an embossing die and a method of measuring a thickness of an embossing die are also disclosed.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.