Heat-resistant SAN resin, method of producing the same and heat-resistant SAN resin composition comprising the same
US9777088B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 14, 2015 |
| Grant date | Oct 3, 2017 |
| Priority date | — |
| Expiry date | Dec 14, 2035 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2201/08
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Disclosed are a heat-resistant SAN resin, a method of producing the same and a heat-resistant SAN resin composition comprising the same. More specifically, disclosed are a heat-resistant SAN resin produced using ingredients comprising 52 to 78% by weight of alpha-methylstyrene, 20 to 40% by weight of a vinyl cyanide compound and 2 to 8% by weight of hydroxyalkyl (meth)acrylate, a method of producing the same and a heat-resistant SAN resin composition comprising the same. Advantageously, provided are a heat-resistant SAN resin with maintained heat resistance, improved polymerization conversion rate and increased weight average molecular weight, a method of producing the same, and a heat-resistant SAN resin composition containing the same with excellent chemical resistance, superior mechanical properties and good balance between properties.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.