Copper alloy and copper alloy manufacturing method
US9777348B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Mar 1, 2010 |
| Grant date | Oct 3, 2017 |
| Priority date | — |
| Expiry date | Nov 29, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01B1/026
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A method of manufacturing a copper alloy is provided, including melting and casting a copper alloy having a composition expressed, in atomic percent, by a formula of Cu100−(a+b)ZraBb, wherein 1.0≦a≦8.0, 0≦b≦4.0, and a+b≦8.0, by a nonrefractory melting method. A cold working with a reduction of about 50% or more for the copper alloy without a solution treatment is performed to provide the copper alloy a dual phase structure having a layered structure including a Cu matrix phase having a plurality of grain particles having an average diameter of about 10 μm or less, and an eutectic phase around the Cu matrix phase. At least part of each grain particle contacts another grain particle within the eutectic phase, and the eutectic phase includes at least one of a Cu—Zr compound and a Cu—Zr—B compound.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.