Micromechanical sensor
US9778038B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Aug 20, 2014 |
| Grant date | Oct 3, 2017 |
| Priority date | — |
| Expiry date | Nov 15, 2035 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01P15/0888
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A micromechanical sensor comprising a substrate (5) and at least one mass (6) which is situated on the substrate (5) and which moves relative to the substrate (5) is used to detect motions of the sensor due to an acceleration force and/or Coriolis force which occur(s). The mass (6) and the substrate (5) and/or two masses (5, 7) which move toward one another are connected by at least one bending spring device (6). The bending spring device (6) has a spring bar (9) and a meander (10), provided thereon, having a circle of curvature (K1; K6; K8; K9; K11) whose midpoint (MP1; MP6; MP8; MP9; MP11) and radius of curvature (r1; r6; r8; r9; r11) are inside the meander (10). For reducing stresses that occur, in addition to the radius of curvature (r1; r6; r8; r9; r11) having the inner midpoint (MP1; MP6; MP8; MP9; MP11), the meander (10) has at least one further radius of curvature (r2; r3; r4; r5; r7; r10) having a midpoint (MP2; MP3; MP4; MP5; MP7; MP10) outside the meander (10). The at least one further radius of curvature (r2; r3; r4; r5; r7; r10) is situated between the meander (10) and the spring bar (9).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.