Sensing chip
US9778183B2 · kind B2 · utility
2Cited by
12References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 20, 2015 |
| Grant date | Oct 3, 2017 |
| Priority date | — |
| Expiry date | Oct 14, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S977/954
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A sensing chip is provided, which includes a substrate and a plurality of nano structures periodically arranged on the substrate, wherein each of the nano structures includes a bottom metal layer disposed on the substrate, a middle dielectric layer disposed on the bottom metal layer, and a top metal layer disposed on the middle dielectric layer. The bottom metal layer has an area that is larger than that of the top metal layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.