Over-mold foam enclosure
US9778687B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 8, 2015 |
| Grant date | Oct 3, 2017 |
| Priority date | — |
| Expiry date | Jul 29, 2035 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2031/3481
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
The disclosure describes methods of fabricating a single-piece housing for an electronic device using an injection molding process. Illustrative fabrication processes describe variations of positioning internal components of an electronic device into a mold enclosure and injecting a foam material to produce a single-piece housing that surrounds the internal components. The single-piece housing may be fabricated to provide the electronic device with at least some buoyancy, as well a means to expel thermal radiation emanating from internal components. Further, the fabricated single-piece housing provides enough structural rigidity to protect internal components of the electronic device from damage, while retaining some malleability to flex without damage when an external pressure is applied.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.