Housing, electronic device using same, and method for making same
US9778698B2 · kind B2 · utility
0Cited by
1References
14Claims
0Family size
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Key dates
| Filing date | Apr 2, 2015 |
| Grant date | Oct 3, 2017 |
| Priority date | — |
| Expiry date | Aug 12, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04M1/026
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A housing includes two base each having at least one sidewall, a gap defined between the two bases and a non-conductive member positioned in the gap, the sidewall has a plurality of grooves, the non-conductive member is filled into the grooves to enhance bonding strength between the non-conductive member and the two bases. An electronic device having the housing and a method of making the housing are also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.