Assembly with a carrier substrate and at least one electrical component arranged thereon, and electrical component
US9780058B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Apr 25, 2016 |
| Grant date | Oct 3, 2017 |
| Priority date | — |
| Expiry date | Apr 25, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/1703
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic assembly has a carrier substrate with contact surfaces and at least one electrical component on the carrier substrate. On its surface that is oriented toward the carrier substrate, the component has a number of contacting solder balls, which are respectively connected to a contact surface assigned to them. On the surface of the electrical component that is oriented toward the carrier substrate there is also arranged at least one fixing solder ball, which has a greater diameter than the contacting solder balls. The carrier substrate has at the location at which the at least one fixing solder ball is in contact with the carrier substrate a depression, in which the fixing solder ball is placed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.