Method of manufacturing a functional inlay
US9780062B2 · kind B2 · utility
2Cited by
4References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 19, 2016 |
| Grant date | Oct 3, 2017 |
| Priority date | — |
| Expiry date | Sep 19, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15153
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The method of manufacturing a functional inlay comprises the steps of:
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.