Adhesive for electronic component
US9780068B2 · kind B2 · utility
0Cited by
1References
4Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Mar 10, 2016 |
| Grant date | Oct 3, 2017 |
| Priority date | — |
| Expiry date | Mar 10, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2852
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
An adhesive composition for a pre-applied underfill sealant comprising: (a) a radical polymerizable monomer having one or more functional groups selected from the group consisting of vinyl group, maleimide group, acryloyl group, methacryloyl group and allyl group, (b) a polymer having a polar group, (c) a filler, and (d) a thermal radical initiator.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.