Wafer-level lens structure for contact image sensor module
US9780133B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Aug 4, 2015 |
| Grant date | Oct 3, 2017 |
| Priority date | — |
| Expiry date | Feb 5, 2036 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B13/0085
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A wafer-level lens structure for contact image sensor (CIS) module includes a printed circuit board (PCB) and an image sensor electrically connected to the PCB and comprising a circuit area and a light sensitive area. The light sensitive area comprises an optoelectronic conversion array, a first lens array arranged on the optoelectronic conversion array and comprising a plurality of first cover lens, each of first cover lens having a first curved face to focus the external image light to the optoelectronic conversion array, and an aperture array arranged on the first lens array and comprising a plurality of apertures to expose the first curved face, the aperture array controlling a light amount passing through the cover lens. The first curved face of the cover lens has such a curvature that a predetermined focus point can be achieved by the plurality of first cover lens.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.