Conductive paste composition and method for manufacturing electrode
US9780236B2 · kind B2 · utility
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6Claims
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Key dates
| Filing date | Nov 25, 2014 |
| Grant date | Oct 3, 2017 |
| Priority date | — |
| Expiry date | Mar 20, 2035 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K2201/001
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Disclosed is a conductive paste composition, including 100 parts by weight of copper powder, 40 to 150 parts by weight of silver powder, 0.1 to 3 parts by weight of carbon powder, 1 to 5 parts by weight of glass powder, and 5 to 15 parts by weight of binder. The conductive paste composition can be applied on a substrate, and then sintered under atmosphere at a high temperature to form an electrode on the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.