Method of assembling an ultrasonic transducer and the transducer obtained thereby
US9780288B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 21, 2012 |
| Grant date | Oct 3, 2017 |
| Priority date | — |
| Expiry date | Sep 15, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N30/872
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
An ultrasonic transducer includes a stack of flat electrodes between which are interposed ceramic wafers of substantially same surface area as the electrodes, stacked contours of the ceramic wafers and electrode wafers defining substantially flat or cylindrical side faces of the stack. A method of manufacturing the transducer includes: alternatively stacking a ceramic wafer and an electrode wafer, placing between each ceramic wafer and its two neighboring electrodes a composition of which at least 75% by weight, or at least 80% by weight, that includes silver nanoparticles having a grain size of smaller than or equal to 80 nanometers, or smaller than or equal to 60 nanometers; and compressing the stack by heating to a temperature of less than or equal to 280° C., or between 200° C. and 250° C.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.