Component mounting method
US9780514B2 · kind B2 · utility
2Cited by
5References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 16, 2013 |
| Grant date | Oct 3, 2017 |
| Priority date | — |
| Expiry date | Apr 9, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53174
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
While a substrate is placed on a substrate placement stage provided in a central substrate transfer unit, the substrate is transferred to a component loading operation unit, after operation for loading a component on the substrate has been performed by the component loading operation unit, the central substrate transfer unit is moved to the side of a first component crimping operation unit to thereby transfer the substrate that remains placed on the substrate placement stage to the first component crimping operation unit, and the component is crimped to the substrate by the first component crimping operation unit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.