Elastic wave device and method for manufacturing the same
US9780759B2 · kind B2 · utility
245Cited by
1References
18Claims
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Key dates
| Filing date | Jun 18, 2013 |
| Grant date | Oct 3, 2017 |
| Priority date | — |
| Expiry date | Sep 6, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/42
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
An elastic wave device propagating plate waves includes a stack of an acoustic reflection layer, a piezoelectric layer, and IDT electrode on a supporting substrate. The piezoelectric layer is thinner than a period of fingers of the IDT electrode. The acoustic reflection layer includes low-acoustic-impedance layers and high-acoustic-impedance layers. The low-acoustic-impedance layers are made of SiO2, and the high-acoustic-impedance layers are made of at least one material selected from the group consisting of W, LiTaO3, Al2O3, AlN, LiNbO3, SiN, and ZnO.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.