Surface pretreatment and drop spreading control on multi component surfaces
US9781829B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jan 21, 2014 |
| Grant date | Oct 3, 2017 |
| Priority date | — |
| Expiry date | Jan 21, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24802
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Methods, systems and produced printed substrates are provided, which include substrates composed of one or more materials which are treated by an intermediate layer for normalizing surface energies and a digitally printed formulation adapted to the normalized surface energies. Surface energy normalization may be carried out by physical processes or by selective chemical processes. In an example, a self-assembled monolayer is applied to the surface of a printed circuit board to control ink jet dots by reducing copper surface energy and to improve ink adhesion. The self-assembled monolayer binds via an α group selectively and covalently to the copper on the board and binds via a hydrophobic ω group to solder mask ink that is applied to the board. The ω group participates in the solidification process of the ink.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.