Electronic module with cooling system for package-on-package devices
US9781863B1 · kind B1 · utility
10Cited by
5References
18Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 4, 2015 |
| Grant date | Oct 3, 2017 |
| Priority date | — |
| Expiry date | Nov 16, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3436
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus for cooling a POP stacked package within a small form factor electronic module by configuring the enclosure of the module to come into direct contact with the device on the top surface in addition to the bottom surface to create two thermal conduction paths for the POP device to the enclosure. The enclosure itself then acts as the heat sink to draw heat from the device and into the surrounding air external to the optical module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.