Hermetic feedthrough assembly for ceramic body
US9782111B2 · kind B2 · utility
1Cited by
16References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 25, 2014 |
| Grant date | Oct 10, 2017 |
| Priority date | — |
| Expiry date | Nov 1, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49222
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wire extends through a ceramic body. The wire comprises a material selected from the group consisting of platinum, palladium, rhodium, iridium, osmium and alloys of platinum, palladium, rhodium, iridium, and osmium. The wire directly contacts the ceramic body to form a substantially hermetic seal between the ceramic body and the wire.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.