3D print adhesion reduction during cure process
US9782934B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 13, 2015 |
| Grant date | Oct 10, 2017 |
| Priority date | — |
| Expiry date | May 13, 2035 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB33Y30/00
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Methods, systems, and apparatus include computer programs encoded on a computer-readable storage medium, including a system for reducing adhesion during cure processing for a stereolithographic 3D printed object. The system includes resin tank for maintaining a liquid photopolymer resin. The system further includes a light source. The system further includes controller for selectively exposing the liquid photopolymer resin to form a solid object in the resin tank. The resin tank is constructed of a rigid material that has an oxygen permeability that is above a first threshold so as to reduce a separation force required to remove the solid object from the resin tank after curing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.